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1 publication order number : LC898123F40XC/d ? semiconductor components industries, llc, 2016 august 2016 - rev. 1 ordering information see detailed ordering and shipping info rmation on page 11 of this data sheet. www.onsemi.com LC898123F40XC optical image stabilization (ois) / auto focus (af) controller & driver with 40kb flash memory 1. overview LC898123F40XC is a system solution integrating an ultra-low-power 32-bit dsp, flash memory, and analog peripherals for oi s (optical image stabilization) /af (auto focus) control, h-bridge, and linear drivers. available in a tiny 3.22mm x 2.30mm chipscale package, this device?s 40kb flash memory enables high level commands and user data for greater system flexibility. 2. features ? on-chip ultra-low-power 32-bit dsp ? built-in software digital servo filter ? built-in software gyro filter ? flash memory ? 40 kbyte flash memory to store data and dsp software ? peripherals ? built-in hall op amp with internal 5 ? , 10 ? , 13 ? , 20 ? , 40 ? , and 60 ? adjustable gain ? 4-channel, 14-bit a/d converter for hall input ? 3-channel, 3-bit d/a converter for hall offset setting ? 3-channel, 8-bit d/a converter for hall bias setting ? built-in 1-mhz 2-wire seri al interface with clock stretch function ? digital gyro interface for various types of gyro (spi bus) ? built-in 41-mhz oscillator ? built-in ldo (low dr op-out regulator) ? package ? wlp35 (35-bump chipscale) ? 3.22 mm ? 2.30 mm , 0.45 mm thick ? 0.4 mm bump pitch ? pb-free and halogen free ? motor driver ? ois 2-channel constant current linear driver (i full = 200 ma) 2-channel h-bridge pwm driver (i omax = 220 ma) ? op-af (unidirection) 1-channel constant current linear driver (i full = 150 ma) ? op-af (bidirection) 1-channel constant current linear driver (i full = 150 ma) ? cl-af 1-channel constant current linear driver (i full = 150 ma) 1-channel h-bridge pwm driver (i omax 150 ma) ? power supply voltage ? ad/da/vga/ldo/osc: avdd30 = 2.6 to 3.3 v ? digital i/o (except gyro i/f): avdd30 = 2.6 to 3.3 v ? driver: vm = constant current: 1.75 to 3.3 v h bridge pwm: 2.6 to 3.3 v ? core logic / gyro interface i/o generated by internal ldo: dvdd15 = 1.55 v output (typ) wlcsp35, 3.22x2.3
LC898123F40XC www.onsemi.com 2 3. block diagram mon1 ain0 ain1 ain2 ain3 mon2 adc opinpaf opinmaf opinpy opinmy opinpx opinmx hlafbo hlybo hlxbo dac ctrl adc ctrl system ctrl timer work ram: dma0 work ram: dma1 work ram: dmb program rom lpdsp32 i2c (slave) spi (master/slave) (d-gyro i/f) uart pwm/current linear ctrl h-bridge driver osc/pll clock divider scl sda wpb eirq1 sda scl scl2 (txd) sda2 (rxd) dgssb dgsclk dgdata dgdin out1 out2 out3 out4 out5 out6 vm pgnd por ldo exclk avdd30 avss host cpu (master) digital gy ro (slave) hall x hall y pll port i2c (slave) dac hall af ldopo(dvdd15 ) dvss i2c (master) flash i/f flash sda scl rxd txd sda scl
LC898123F40XC www.onsemi.com 3 4. application diagram lens vcm hall sensor LC898123F40XC eeprom digital g y ro i 2 c spi ois / af a ctuator camera module image sensor ap / isp position
LC898123F40XC www.onsemi.com 4 5. package dimensions unit : mm wlcsp35, 3.22x2.3 case 567lj issue o seating plane 0.10 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max millimeters a1 d 3.22 bsc e b 0.15 0.25 e 0.40 bsc 0.45 e d a b pin a1 reference e a 0.05 b c 0.03 c 0.08 c 35x b 4 c b a 0.10 c a1 c 0.03 0.13 2.30 bsc 0.20 35x dimensions: millimeters *for additional information on our pb-free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.40 0.40 0.10 c 2x top view side view bottom view note 3 e recommended package outline 123 pitch d e pitch a1 a f g 5
LC898123F40XC www.onsemi.com 5 6. pin assign g out4 out3 out2 out1 vm f mon1 sda2 (rxd) wpb pgnd out6 e mon2 scl2 (txd) dvss exclk out5 d dvdd15 eirq1 av ss sda scl c av dd30 hlafbo av ss hlybo hlxbo b dgdata dgssb opinmaf opinmy opinmx a dgsclk dgdin opinpaf opinpy opinpx 1 2 3 4 5 bottom view driver output analog v dd driver v dd analog gnd driver gnd digital gnd logic core v dd (output)
LC898123F40XC www.onsemi.com 6 7. pin descriptions pin num pin i/o atr i/o pwr (v) primary function (just after reset) sub functions init a1 dgsclk b 1.55 digital gyro i/f clock input digital gyro clock output z digital gyro i/f clock output internal signal monitor a2 dgdin b 1.55 digital gyro data input (4 wired) i 2 c data i/o for dac monitor z internal signal monitor a3 opinpaf i 2.8 af hall opamp input plus ? ? a4 opinpy i 2.8 ois hall y opamp input plus ? ? a5 opinpx i 2.8 ois hall x opamp input plus ? ? b1 dgdata b 1.55 gpio input digital gyro i/f data output (4 wired) z digital gyro i/f data i/o (3 wired) internal signal monitor b2 dgssb b 1.55 digital gyro i/f chip select input digital gyro i/f chip select output z digital gyro i/f chip select output internal signal monitor b3 opinmaf i 2.8 af hall opamp input minus ? ? b4 opinmy i 2.8 ois hall y opamp input minus ? ? b5 opinmx i 2.8 ois hall x opamp input minus ? ? c1 avdd30 p ? analog power (2.6 to 3.3 v) ? ? c2 hlafbo o 2.8 af hall bias output ? ? c3 avss p analog gnd ? ? c4 hlybo o 2.8 ois hall y bias output ? ? c5 hlxbo o 2.8 ois hall x bias output ? ? d1 dvdd15 p - internal ldo power output ? ? d2 eirq1 b 2.8 external irq1 i 2 c data i/o for dac monitor d uart data output (txd) spi i/f chip select output external clock input internal signal monitor servo monitor analog input d3 avss p ? analog gnd ? ? d4 sda b 2.8 i 2 c data ? z d5 scl b 2.8 i 2 c clock ? z e1 mon2 b 2.8 (debugger data input) i 2 c data i/o for dac monitor z uart data input (rxd) servo monitor analog out internal signal monitor e2 scl2 (txd) b 2.8 i 2 c clock for 2nd i 2 c i 2 c data i/o for dac monitor z uart data output internal signal monitor e3 dvss p ? logic gnd ? ? e4 exclk b 2.8 external clock input i 2 c data i/o for dac monitor d external irq1 internal signal monitor e5 out5 o 2.8 af driver output (h-bridge, linear) ? ? f1 mon1 b 2.8 (debugger data output) i 2 c data i/o for dac monitor l uart data output (txd) servo monitor analog out internal signal monitor f2 sda2 (rxd) b 2.8 i 2 c data for 2nd i 2 c i 2 c data i/o for dac monitor z uart data input internal signal monitor f3 wpb i 2.8 write protect for flash ? d f4 pgnd p ? driver gnd ? ? f5 out6 o 2.8 af driver output (h-bridge, linear) ? ? g1 out4 o 2.8 ois driver output ? ? g2 out3 o 2.8 ois driver output ? ? g3 out2 o 2.8 ois driver output ? ? g4 out1 o 2.8 ois driver output ? ? g5 vm p ? driver power (2.6 to 3.3 v) ? ?
LC898123F40XC www.onsemi.com 7 8. electrical characteristics absolute maximum rating at avss = 0 v, dvss = 0 v, pgnd = 0 v parameter symbol conditions ratings unit power supply voltage v ad 30 max ta ? 25 ? c ? 0.3 to +4.6 v vm max ta ? 25 ? c ? 0.3 to +4.6 v input voltage (except dgdata, dgssb, dgsclk, dgdin) v ai 30 ta ? 25 ? c ? 0.3 to v ai 30+0.3 v input voltage (dgdata, dgssb, dgsclk, dgdin) v ldo 18 ta = ? 30 to +85 ? c ? 0.3 to +1.872 v storage temperature tstg ? 55 to +125 ? c operating temperature topr ? 30 to +85 ? c output continuous current iomax out1 to 4 210 ma out5, out6 157.5 ma allowable operating ratings at ta = ? 30 to +85 ? c, avss = 0 v, dvss = 0 v, pgnd = 0 v 3.0v power supply (avdd30) parameter symbol min typ max unit power supply voltage v ad 30 2.6 2.8 3.3 v input voltage range v in 0 ? v ad 30 v 3.0v power supply (vm) parameter symbol min typ max unit power supply voltage (h-bridge pwm) v m 30 2.6 2.8 3.3 v power supply voltage (constant current) 1.75 2.8 3.3 v input voltage range v inm 0 ? v m 30 v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should n ot be assumed, damage may occur and reliability may be affected. functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresses beyond the recomme nded operating ranges limits may affect device reliability.
LC898123F40XC www.onsemi.com 8 dc characteristics : input/output level at avss = 0 v, dvss = 0 v, pgnd = 0 v,v dd = 2.6 to 3.6 v, ta = ? 30 to +85 ? c parameter symbol conditions mi n typ max unit applicable pin high-level input voltage vih cmos schmitt 1.36 v scl2(txd), sda2(rxd), exclk low-level input voltage vil 0.39 v high-level input voltage vih cmos schmitt 1.26 v dgdin, dgssb, dgsclk, dgdata low-level input voltage vil 0.35 high-level input voltage vih cmos schmitt 1.40 scl, sda low-level input voltage vil 0.40 v high-level input voltage vih cmos schmitt 1.48 eirq1, wpb low-level input voltage vil 0.37 high-level input voltage vih cmos supported 1.40 mon1, mon2 low-level input voltage vil 0.51 high-level output voltage voh ioh = ? 2 ma avdd30 ? 0.4 v scl2(txd), sda2(rxd), exclk, eirq1, mon1, mon2 high-level output voltage voh ioh = ? 0.1 ma 1.32 v dgdin, dgssb, dgsclk, dgdata low-level output voltage vol iol = 2 ma 0.2 v scl2(txd), sda2(rxd), dgdin, dgssb, dgsclk, dgdata, exclk, sda, scl low-level output voltage vol iol = 2 ma 0.4 v mon1,mon2,eirq1 analog input voltage vai avss avdd30 v opinpx, opinpy, opinpaf, opinmx, opinmy, opinmaf pullup resistor rup 50 200 k ? mon1, mon2, eirq1, scl2(txd), sd2(rxd) pullup resistor rup 180 800 k ? dgdata, dgdin, dgssb, dgsclk pulldown resistor rdn 50 220 k ? mon1, mon2, eirq1, scl2(txd), sda2(rxd), exclk, wpb pulldown resistor rdn 120 500 k ? dgdata, dgdin, dgssb, dgsclk driver output at ta = ? 30 to +85 ? c, avss = 0 v, dvss = 0 v, pgnd = 0 v parameter symbol condition min typ max unit output current out1 to out4 i full full code 200 ma output current out5, out6 full code op-af (bidirection / unidirection) cl-af 150 ma non-volatile memory characteristics parameter symbol condition min typ max unit endurance en 1000 cycles data retention rt 10 years product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product per formance may not be indicated by the electrical characteristics if operated under different conditions.
LC898123F40XC www.onsemi.com 9 9. ac characteristics 9-1 power sequence item symbol min typ max units rise time tr 3 ms wait time tw 100 ms bottom voltage vbot 0.2 v injection order between avdd30 and vm is below. avdd30 vm vm Q avdd30 + 0.5v (vm Q 3.3v) 2.6v 2.6v tvmrd R 0ms tavfd R 0ms wpb tavfd tvmrd wpb must be open or pulled down normally. when flash is erased or programmed, wpb must be held high. sda, scl, exclk, and wpb will tolerate 3 v input at the time of power off. power must remain applied to the device during flash access in order to prevent unintentional rewriting of the flash memory. data in flash memory may be rewritten unintentionally if the specified power sequencing techniques are not kept.
LC898123F40XC www.onsemi.com 10 9-2 two wire serial interface timing the device?s communication protocol is compatible with i 2 c (fast mode plus). this circuit has clock stretch function. item symbol pin name min typ max units scl clock frequency fscl scl 1000 khz start condition hold time thd,sta scl sda 0.26 ? s scl clock low period tlow scl 0.5 ? s scl clock high period thigh scl 0.26 ? s setup time for repetition start condition tsu,sta scl sda 0.26 ? s data hold time thd,dat scl sda 0 (*1) 0.9 ? s data setup time tsu,dat scl sda 50 ns sda, scl rising time tr scl sda 120 ns sda, scl falling time tf scl sda 120 ns stop condition setup time tsu,sto scl sda 0.26 ? s bus free time between stop and start tbuf scl sda 0.5 ? s (*1) although the i 2 c specification defines a condition that 300 ns of hold time is required internally, LC898123F40XC is designed for a condition with ty p. 40 ns of hold time. if sda signal is unstable around falling point of scl signal, please implement an appropriate counterm easure on board, such as inserting a resistor. sd scl
LC898123F40XC www.onsemi.com 11 on semiconductor and the on semiconductor logo are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries in the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and othe r intellectual property. a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf. on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does on semiconductor assume any liability arising out of the app lication or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, regulations and safety require ments or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the rights of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life sup port systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended fo r implantation in the human body. should buyer purchase or use on semiconductor products for any such unintended or unauthorized application, buyer sh all indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, d amages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resal e in any manner. ordering information device package shipping (qty / packing) LC898123F40XC-vh wlcsp35, 3.22x2.3 (pb-free / halogen free) 4000 / tape & reel ? for information on tape and reel specifications, including part orientation and tape sizes, plea se refer to our tape and reel packaging specifications brochure, brd8011/d. ht tp://www.onsemi.com/pub_lin k/collateral/brd8011-d.pdf

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